advertisment Advertisement
This ad will close in  seconds. Skip now
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Industry News

Intelligent transportation key technology enabler of smart cities

March 13, 2014

With more than two-thirds of the global population expected to live in urban contexts by 2050, the deployment of smart cities technologies and intelligent transportation services in particular, will become key policy areas for local governments.  By 2025, penetration of ITS technologies in smart cities will range from 20% (autonomous vehicles) to 98% (traffic management).


Read More

Northrop Grumman begins integrating high-speed downlink antennas for 4th Advanced EHF communications payload

March 13, 2014

Two downlink antennas that are the fastest of their kind to operate in space are being integrated into the protected communications payload built by Northrop Grumman Corp. for the fourth Advanced Extremely High Frequency (AEHF) satellite.


Read More

Exelis GPS threat detection capability helped to safeguard Super Bowl XLVIII

March 13, 2014

Signal Sentry 1000, an Exelis product that detects and locates GPS interference sources in 3-D by using longitude, latitude and altitude, was deployed during Super Bowl XLVIII at the MetLife Stadium in East Rutherford, N.J.


Read More

Molex zCD AOC interface scalable up to 400 Gbps

March 13, 2014

The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module.  The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.


Read More

TriQuint introduces 130 W SSPA for Ka-Band satellite communications

RFIC
March 12, 2014

TriQuint Semiconductor Inc. announced that its Spatium™ technology achieves unprecedented levels of Ka-Band solid state power, bandwidth and efficiency, which provides greater broadband capacity and opens up new satellite possibilities.


Read More

AWR offers free excerpt of Prof. Fornetti’s “Conquer Radio Frequency” eBook

March 12, 2014

AWR Corp. announces the availability of a free excerpt of the new eBook from Professor Francesco Fornetti, Conquer Radio Frequency – A Multimedia Conceptual Guide to RF and Microwave Engineering. The excerpt includes select Explore RF instructional video tutorials done using AWR’s Microwave Office® circuit design software.


Read More

Agilent to show test and measurement solutions at OFC 2014

March 12, 2014

Agilent Technologies Inc. will show test and measurement solutions at the Optical Fiber Communication Conference & Exposition, March 11-13 in San Francisco, CA. Agilent is the only T&M vendor offering solutions along the entire value chain of the Web 2.0—from components through data centers to telecom, addressing the latest technologies such as silicon photonics and coherent, multi-carrier transmission.


Read More

Accel-RF Instruments introduces automated multi-channel RF-biased burn-in test system

March 12, 2014

Accel-RF Instruments Corp. is the world-leader in supplying equipment for performing measured long-term reliability assessment on compound-semiconductors. To keep up with the shift in GaN from “research novelty” to “market reality”, Accel is expanding its RFBL measurement equipment with the introduction of an 80-Channel RF Bias Burn-In System.


Read More

Indium Corp. hires associate director for sales and marketing for APAC region

March 11, 2014

Indium Corp. announces that Tony Teo has been hired as associate director for sales and marketing for the Asia-Pacific region, including China.  


Read More

Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA
March 11, 2014

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement