Industry News

KCB introduces new concepts in semiconductor packaging at IMS

In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.


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RFMD introduces WiFi front end modules at IMS 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.


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Laser Services offers processing tips at IMS

Engineers at IMS 2012 in Montreal, Canada looking for guidance on how best to employ lasers to aid in cutting, drilling and ablating materials will find help from the Laser Services team in booth #215. One such technique being adopted around the microwave industry is using laser ablation to create solder dams on circuits.


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