Engineers at IMS 2012 in Montreal, Canada looking for guidance on how best to employ lasers to aid in cutting, drilling and ablating materials will find help from the Laser Services team in booth #215. One such technique being adopted around the microwave industry is using laser ablation to create solder dams on circuits. Whereas traditional damming methods of printing and firing glass or other dielectric masks can be costly in terms of processing time, labor, and scrap material, “laser trenches” around a solder pad can be made simply and they are inherently more repeatable. Other tips include ideas and suggestions for cutting ceramic, EMI materials and frozen epoxies, and understanding the nuances of working with adhesives under temperature.

To learn more, stop by booth #215 or visit