Indium Corp. has released a new solder research kit designed for soldering to gold plating using indium-based alloys. Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors.
Indium Corp.'s new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Zentech Manufacturing is pleased to announce the addition of the Nordson DAGE xi3400 AXI system. This new Nordson DAGE AXI system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for both in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
Several Indium Corp. experts will share their technical knowledge with attendees at the Surface Mount Technology Association’s International Conference and Exhibition(SMTAi) from Sept. 28 to Oct. 2 in Rosemont, Ill.
Indium Corp. recently released RMA-155 Pb-free solder paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.