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Agilent Technologies Inc. announced that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the appointment of Alan Hallberg as the company's corporate vice president and chief marketing officer (CMO). In the role of CMO, Hallberg will oversee RFMD's global marketing activities and will be based in RFMD's growing Silicon Valley, CA, location.

As wireless connectivity attach rates increase in many markets and OEMs continue to push for cost savings, IC vendors such as Broadcom, Qualcomm, TI, Marvell, MediaTek and others, have created integrated wireless connectivity solutions to gain market share. These solutions known as Wireless Connectivity Combo ICs have already seen rapid adoption in smartphones and are now seeing strong usage growth in many other end applications including laptops, flat panel TVs, and automotive infotainment systems.

Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., announced that the TM500 LTE-A Test Mobile now supports carrier aggregation for Time Division Duplex (TDD), in addition to its existing Frequency Division Duplex (FDD) capability. Carrier aggregation, a key component of LTE-A, allows multiple carriers comprised of either contiguous or non-contiguous spectrum to be added together, allowing wider channel bandwidths - and higher data rates - to be achieved.

Agilent Technologies Inc. announced the launch of a new web portal that allows customers to manage their relationship with Agilent and receive information personalized to their interests and the products they own.

Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.

FUJITSU TEN Ltd. has developed "automotive compact 77GHz three-dimensional electronic scan millimeter-wave radar" that is capable of detecting an object in three dimensions, including "elevation" range in addition to distance and azimuth range. While making further improvements, FUJITSU TEN will aim at delivering this product to automobile manufacturers from 2014.

STMicroelectronics, Soitec (Euronext) and Circuits Multi Projets^®(CMP) announced that ST’s CMOS 28 nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.

Milmega Ltd. has been presented with the Queen’s Award for Enterprise in Innovation for developing amplifiers based on a novel design methodology, using gallium nitride-based transistor technology, which has brought the Company significant, global, commercial success.

Underwriters Laboratories has chosen Anritsu as its provider for LTE telecoms equipment, becoming the first commercial independent LTE conformance test facility in the UK.