STMicroelectronics, one of the world’s largest semiconductor manufacturers and a world leader in MEMS and power ICs, is to be the principal sponsor of the 17th European Microelectronics and Packaging Conference & Exhibition (EMPC 2009). The company will work with the organizer, the Italian chapter of the International Microelectronics and Packaging Society (IMAPS), and in collaboration with the IEEE Components Packaging and Manufacturing Technology society (CPMT), to assemble a powerful and informative program. The three-day conference and exhibition will be held from June 15-18, 2009, at Palacongressi in Rimini, and will be complemented by advanced professional courses as well as poster sessions.
As part of the sponsor agreement, ST will be inviting certain key clients to participate at the plenary sessions of the events as well as contributing articles to the general sessions. The company will also be inviting other key technology partners such as research institutions and subcontract suppliers to contribute.
The associated exhibition will be an opportunity for packaging equipment manufactures and materials suppliers to the microelectronics industry to demonstrate the latest advances. Exhibitors will include suppliers of materials, equipment or components, service providers, manufacturers, research specialists and academic bodies. As an added benefit, close co-ordination between the conference program and the exhibition will provide ample time for conference delegates to visit the exhibition and discuss exhibitors’ opinions.