C-MAC MicroTechnology, a leader in high-reliability electronic systems, modules and components for the automotive, aerospace, defense, high-reliability industrial, specialized communication and medical electronics industries, has enhanced its accredited UK testing facility with significant investment to provide a new solderability testing capability.
Component failure at board level is often attributed to solder joint faults. The new solderability testing capability provides reassurance for component manufacturers and users by reducing the risk of faults leading to improved yields and reliability. This new service joins the company’s wide range of ISO 17025 accredited test methods, which include temperature cycle, thermal shock, high humidity, salt mist, salt corrosion, high and low temperature storage and insulation resistance.
The test house allows the rigorous testing of printed circuit board assemblies, hybrid modules and other electronic components employed in harsh environments, such as satellites, automotive applications and military aircraft. It is one of the few UK facilities used by C-MAC and other companies to ensure that components manufactured in Europe meet the stringent requirements of IEC 68, MIL-STD 883 and MIL-STD 202 test methods.
Paul Hill, C-MAC general manager, commented, “Our investment in the new solderability testing capability is further indication of C-MAC’s commitment to maintaining the highest standards. As a leading European test facility we will continue to meet industry standards to ensure our products and our customer’s products are rigorously tested to the highest level.”