AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014. V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.
Additional presentations and workshops being offered by AWR and its parent company of National Instruments during EDICON include:
|
Date & Time |
Topic & Presenter |
|---|---|
|
Tuesday, April 8 |
Effect of Pre-selection and Roofing Filters on Over-the- air Measurements |
|
Tuesday |
Addressing the Challenges of Synchronization in Envelope Tracking Test Solutions |
|
Tuesday |
Digital Predistortion Techniques for Mobile PA Test |
|
Tuesday |
Survey of Wireless Transmitter & Receiver Metrics in Modern Wireless Standards |
|
Wednesday |
Implementing Reference Designs in Microwave Office Software |
|
Wednesday |
Class F Power Amplifier Design within AWR Microwave Office Software and Featuring Cree |
|
Wednesday |
Intrinsic Cree GaN HEMT Models Allow More Accurate Waveform Engineered PA Designs |
|
Wednesday |
Increase WLAN Manufacturing Test Throughput with Multi-DUT Test |
|
Thursday |
Analog RF Test Methodology & Architecture for NFC Devices |
|
Thursday |
High-frequency PCB Design and Analysis: Cross-platform Flows/Solutions |
|
Thursday |
An Integrated Electro-thermal MMIC/RFIC Design Flow |
|
Thursday |
Comparison of the EMVCo and ISO18047 Power Calibration Method |
|
Thursday |
Combining Planar and 3D EM Simulators for RF Interconnect Analysis: Techniques for Better Results |
|
Thursday |
EDA Design Flow Panel |
|
Thursday |
The Future of Telecommunications Technology Panel |
Where:
Booth #301
EDICON 2014 - Beijing International Convention Center
Beijing, China
When:
April 8, 2014 through April 10, 2014
