Items Tagged with 'design'

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EnSilica has partnered with Cross Border Technologies to accelerate the sales of both its IC design services and system IP solutions in key European and Asian markets, particularly Germany, France, Japan and Korea.

Agilent Technologies Inc. will demonstrate 25 of its newest design and measurement solutions at the IEEE MTT-S International Microwave Symposium (Booth 1230), June 2-7, at the Washington State Convention Center in Seattle.

AWR Corp., the innovation leader in high-frequency EDA software, is a gold sponsor and will offer a full agenda of activities at the International Microwave Symposium (IMS) 2013 that inform and educate attendees about new ways to use RF/microwave software for circuit and system design. IMS 2013 takes place from June 4 to 7 in Seattle, Washington.

NXP Semiconductors N.V. announced the availability of its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). The new 70W DVB-T LDMOS designs bring the high-efficiency gains of Doherty topologies to broadcast transmitters, using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum.

AWR has posted a university success story detailing how Nanjing University of Aeronautics and Astronautics (NUAA) evaluated AWR’s Microwave Office RF and microwave design software as well as its AXIEM EM simulator for university research and education programs.

Lab-Flex® AF, a modified version of the popular Lab-Flex series is now available from Florida RF Labs. This new family of cables has been enhanced to perform in typical harsh environments associated with airborne, shipboard and ground-based applications. Florida RF Labs proprietary cable assembly design utilizes a redundant sealing system to prevent water ingress in both cable and connector interfaces and it employs a very durable dielectric design which is able to withstand crushing or kinking.

AWR Corp., the innovation leader in high-frequency EDA software, announced the start of its AWR Design Forum 2013 tour with a diverse schedule of dates and venues in the Asia Pacific region starting this summer. ADF is an open event at which designers of microwave and RF circuits and systems such as MMIC, RF PCB, and LTE can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends. Details are available at http://www.awrcorp.com/ADF2013.

AWR’s new application note titled, "Multisim/Ultiboard for Low-Frequency Simulation and Layout" details how to complement Microwave Office® circuit design software with NI’s Multisim circuit simulation software and Ultiboard printed circuit board (PCB) layout software for a comprehensive design flow.