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National Instruments/AWR named as corporate sponsors of EDI CON 2014

October 18, 2013
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Horizon House Publications and Microwave Journal China announced that National Instruments (NI) and its fully-owned subsidiary AWR Corp. will be the corporate sponsors of the Electronic Design Innovation Conference (EDI CON) 2014 in Beijing, China April 8-10, 2014. As the corporate sponsors, NI and AWR will collaborate with conference organizers and technical advisory committee to ensure that the technical program provides EMI/EMC, RF, microwave and high-speed digital engineers and system integrators with the most recent and pertinent information relating to wireless communications.

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.

NI/AWR will provide their expertise in their graphical system design platform (LabVIEW), modular test hardware and EDA design tools (Microwave Office and more). The company’s global and local technologists will present papers and workshops specifically tailored to the engineering concerns of the China market in addressing design, test, at device characterization at the component and system levels. NI will also present the company’s vision of evolving technology trends impacting the engineering community during the plenary keynote sessions.  

Source: Horizon House Publications and Microwave Journal China

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