Friday, April 30, 2010 - Chandler, AZ – Rogers Corporation’s Advanced Circuit Materials Division won the laminates category of the New Product Introduction (NPI) Award given out by UP Media Group’s Circuits Design and Printed Circuit Design & Fabrication magazine.
The NPI Awards, which recognize leading new products introduced during the past 12 months, were presented at a special ceremony during the IPC APEX Expo™ held in Las Vegas in April. An independent panel of practicing industry engineers selected the award recipients.
RO4360™ laminate material is a groundbreaking new product—the first high DK RF grade thermoset laminate material to go to market. With its tailored high Dk of 6.15 @ 10 GHz, RO4360 laminate allows next generation power amplifier designers to meet size and cost reduction targets, where the laminate’s higher Dk allows for a significant reduction (20-30%) in finished circuit board size. RO4360 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B™ material.
UL 94V-0 flame rated and fully lead-free process capable, RO4360 laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.
Typical applications for RO4360 laminates are power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic). RO4360 laminates are the material solution designers working on 4G and next generation defense/aerospace platforms have been looking for.