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Mission-critical RF component selection has experienced remarkable advancements with breakthroughs in materials science, semiconductor technology, and design methodologies. These innovations have paved the way for the development of components capable of operating under extreme conditions, delivering unparalleled performance, and ensuring seamless interoperability within complex communication infrastructures. This eBook covers new developments in SDRs, filter topologies, semi-rigid cable assemblies, RF over fiber and a modular approach to phased arrays. These new developments will assist the design engineer in some new approaches to RF component selection for mission critical applications.

The March 2024 Cable and Connector Special Focus section contains several articles covering the RF connector market for basestations, the growing challenge of counterfeit cables, and technology innovations. There are also product articles including SMP-MAX and 65 GHz adapters plus a new products section covering products from various companies. Don’t miss this eBook covering the latest innovations in cable and connector technology

For engineers and researchers working in the field of RF and microwave devices, the design considerations outlined in this eBook serve as a valuable resource. Practical insights and real-world applications offer a hands-on approach to implementing the latest strategies for achieving optimal amplifier linearity in communications systems. The “Impact of Amplifier Linearity on Communications Systems Performance” is a timely and indispensable guide for those seeking to stay at the forefront of technological progress in the ever-evolving world of communications. As we embrace the future of connectivity, this eBook equips its readers with the knowledge and skills needed to navigate the intricate landscape of amplifier design with confidence and innovation.

5G has been rolling out for several years now but each 3GPP release is adding new capabilities to realize the full potential of the technology while companies are improving on device and system design to improve performance and cost. This eBook is part of our Nov 5G/6G and IoT themed issued focusing on 5G. The articles cover an overview of V2X technology, RF Front end design, a new cooling technology for 5G active antenna systems, new innovations in 60 NLOS technology, phase noise analysis for radar/SATCOM systems and new products in the industry.

The challenges that the industry is facing and the solutions that are being developed at each step of the supply chain to enable the 5G future form the basis for this eBook. The first entry dives into the 5G market, with a focus on base stations. It provides a good summary and forecast of the trends, drivers, ecosystem, technology shares and market segmentations for PAs in base station applications. The second entry describes integrating DAS networks to improve 5G coverage and article three provides and discusses the benefits of transitioning to a 5G standalone (SA) network. The fourth article gives a good overview of the importance of power amplifiers in 5G architectures and the challenges and advantages of integrating functions into PA modules. The final article discusses the benefits of Open RAN, a standardized approach to radio access network hardware and software disaggregation and how front-end reference designs can enable massive MIMO, which has become an essential. building block of the 5G future.

Microwave subsystems are complicated and have many tradeoffs in design. This is especially true with RF filter products. To help engineers navigate RF filter procurement, Q Microwave has created this comprehensive guide covering RF filter materials, configurations and packaging. This eBook reviews filter design, material selection, packaging, SWaP-C, and customization to meet unique needs.

This eBook addresses some of the challenges and best practices when designing and fabricating PCBs for RF applications. The first article gives a good overview of the fabrication process for a variety of different multilayer printed circuit boards. The second article provides insight into the reality of PCB fabrication versus the ideal models and how those differences become more important as circuits go higher in frequency. Article three acknowledges that these PCBs will operate at elevated temperatures, and it provides insight into the failure mechanisms, test methods and proper selection of substrate materials to optimize temperature performance. The fourth article provides good technical details about how to select the proper circuit board dielectric mate-rial as applications go higher in frequency. The final two articles address the finer points of the board design and manufacturing process for a microwave power amplifier and a microwave/millimeter wave patch antenna.

The need to address EMC/EMI problems has never been more pressing. As electronic devices become smaller, faster, and more powerful, the potential for interference grows exponentially. It's no longer sufficient to simply design and build electronic systems without considering their EMC/EMI characteristics. Engineers, designers, and technicians must proactively identify and mitigate these issues to ensure that their products meet regulatory standards, perform reliably, and avoid costly setbacks. This eBook provides an understanding of the underlying principles, practical methodologies, and advanced techniques for dealing with EMC/EMI challenges. It is designed for both newcomers seeking a foundational knowledge of the subject and experienced professionals looking to deepen their expertise.

This eBook explores several new trends in aerospace and defense. It covers a variety of topics including pulse droop in long pulse width, high-power, solid-state amplifiers used for radar and EW systems; how the creation of an air cavity in the PCB stack-up decreases the insertion losses of the traces and increas¬es the antenna performance in the mmWave bands; dis¬cussion of supply chain security and counterfeit detection using universal chip telemetry; and the nuances of space level qualification and the screening process for these devices.

This eBook addresses some of the challenges and considerations when developing architectures and components to support these new multi-band, multi-services capabilities. The first article gives a good overview of multi-band microwave direct access using synthetic aperture radars using earth observation applications as an illustration. Articles two through four address how direct data converters and other components are enabling software satellites and other multi-band, multi-services transceivers. The final two articles explore using data converters and signal processing, in conjunction with optical interconnects to replace copper in the transport layer. We hope that this eBook gives you a good overview of the possibilities that can be enabled by high performance, direct access, multi-band, multi-services networks.