eBooks

This A&D Electronics Special Supplement eBook covers topics such as applications for RF over fiber technology, international spectrum supportability for software defined radios, troubleshooting AESA T/R modules and test stations, liquid cooled SSPAs for SATCOM uplinks, SMT mmWave converters with digital control, fiber optic cables for harsh environments, high-power solid-state amplifiers and power MOSFETs/ICs.

This eBook explores the trends in T&M from equipment to procedure, including calibration, test methods and software advancements. The first article provides a market overview, including projected overall growth, success drivers and a breakdown of the equipment market ecosystem. The second article in this eBook highlights the benefits of coaxial conductive testbeds in comparison to standard over-the-air (OTA) testing for a variety of DUTs. The third article compares passive versus active wideband load-pull methods. It highlights the advantages of wideband active load-pull solutions and includes case studies on their applications. The fourth article uses a case study on voltage variable attenuators to address advancements in software techniques for RF component testing and calibration. The fifth article explores different types of RF benchtop testing and the evolution of testing components, cables and instrumentation. Finally, in the sixth article, Spectrum Control addresses the four trends transforming the test and measurement sector.

As AI use increases, the IoT widens, 6G expands and quantum advantage gets closer on the horizon, technologists must consider the infrastructure needed to enable and support this growth. Learning from history, the RF and microwave industry is relying on higher frequency expansion to support these new innovations, this time turning to the sub-THz and THz bands. This eBook highlights new innovations, requirements and best practices for the sub-THz and THz market. The first article addresses the challenges and potential solutions regarding the characterization of D-Band power amplifiers. The second article focuses on fabrication techniques and cost, including material selection and nanofabrication, for components supporting THz frequencies. The third article, focusing on sub-THz antenna design, and the fifth article, focusing on sub-THz and THz reflection coefficients in different materials, address the rising influence of 6G communications. Finally, the fourth article addresses the importance of noise sources in test and measurement setups and the industry’s new noise-related technologies in climbing frequency bands. Altogether, this eBook addresses a variety of innovations and ongoing challenges in the RF and microwave industry’s foray into the sub-THz and THz frequency bands.

The Satellite & Space Special Focus eBook is part of the May issue and covers space grade RF connectors, smart sourcing for RF, space situational awareness, and SATCOM market trends and forecasts. There are product feature articles covering K-/Ka-Band SATCOM with embedded encryption, radiation tolerant MOSFETs, and fusion of SDR and SoC technologies. There is also a Tech Brief on precision frequency control and timing from PLDROs along with a new products section. 

This eBook includes articles on challenges, best practices and goals in the satcom industry. The first article, addressing interference patterns in the lunar environment, and the fourth article, embracing a collaboration for innovation theme, focus on antennas. The second article addresses fixture and testing challenges at high frequencies and offers solutions for chip bonding, fixturing and mounting. The third article broadens the horizon with commentary on the shift from satellite-to-satellite capabilities to direct-to-device capabilities. When we previously needed a separate satellite phone, we are now able to use satellite service on the phones in our pockets. The fifth article, focusing on the RF signal chain for satcom applications, and the seventh article, focusing on harsh environment fixed attenuators, both bring readers back to the hardware aspect of satcom requirements. Finally, the sixth article addresses the system design challenges for engineers, specifically the impacts of the Doppler effect on LEOs and large constellations.

The growth drivers for revenue in the radar market relate to the fast capability evolution of phased array radar systems and the new applications that these capabilities and technologies will enable. However, these capabilities and applications will not evolve without advancements across the phased array radar supply chain. Exploring the latest developments in the ecosystem and supply chain forms the basis for the articles in this eBook. The first article addresses how emerging gradient index technology, coupled with additive manufacturing techniques, can provide different solutions for phased array performance and SWaP-C challenges. The second article explores the differences between digital and hybrid phased arrays. It looks at the proper way to power the FPGAs that are crucial for either beamforming/beam steering approach. The third article reminds readers that radar systems operate in environments with intentional and unintentional interfering signals. It discusses architectures and challenges for protecting the systems in the presence of these interferers. The fourth article describes simulation techniques to provide faster, less expensive ways to predict phased array performance. The fifth and final article describes an over-the-air approach to testing and calibrating millimeter wave phased arrays.

The March 2025 Cable and Connector special focus eBook has articles covering new developments in interconnects for RF benchtop testing and modular connections for vehicle applications. There are product articles a new connector design for phase stability, high density connectors for testing and selecting the proper RF cable assembly. There is also a new products section.

Exploring the latest developments in cables, connectors and testing forms the basis for the articles in this eBook. These articles will give the reader a good understanding of techniques, tips and best practices for measurement systems and the role cables and connectors play in the evolution of these systems. The first article deals solely with connectors. It offers connector fundamentals, along with five tips to optimize connector performance and ensure long-term reliability and repeatability. Some of the remaining articles address best practices and techniques for making accurate, repeatable measurements, characterizing uncertainty, improving calibration accuracy and speed and ensuring that your measurement system remains optimized. The rest of the articles discuss the critical role that cables play in measurement. They deal with requirements, theory and practical considerations involved with high-performance cable design and selection.

Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook. 

These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.

This IoT Special Focus eBook covers wireless power transfer and technology outlook, new AWGs and digitizers, a new dual band patch antenna design and new products from various companies.