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To prevent unwanted flow, many PCB designers will install dams formed of glass or other dielectric materials to keep solder from shorting active areas on a circuit. But there is another solder damming technique being rapidly adopted—laser ablation. Considered to be more accurate and consistent than traditional solder damming methods.
Although the commercialization of LTE technology began in end 2009, the technology is still being enhanced in order to meet ITU-Advanced requirements. This application note summarizes these necessary improvements, which are known as LTE-Advanced.
Since the year 2010 commercialization of the LTE technology is taking place. At the same time further enhancements of the LTE technology are worked on in order to meet ITU-Advanced requirements. This application note summarizes these necessary improvements known as LTE Advanced.