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High Speed Downlink Packet Access (HSDPA) and High Speed Uplink Packet Access (HSUPA) optimize UMTS for packet data services in downlink and uplink, respectively. Together, they are referred to as High Speed Packet Access (HSPA). Within 3GPP release 7 and 8, further improvements to HSPA have been specified in the context of HSPA+ or HSPA evolution. This application note introduces key features of HSPA+ and outlines the changes to the radio interface.
Modern radio communication systems have to provide higher and higher data rates. As conventional methods like using more bandwidth or higher order modulation types are limited, new methods of using the transmission channel have to be used. Multiple antenna systems (Multiple Input, Multiple Output – MIMO) gives a significant enhancement to data rate and channel capacity. This application note gives an introduction to basic MIMO concepts and terminology and explains how MIMO is implemented in different radio communications standards.
This application note describes ATSC Mobile DTV standard A/153, ATSC-M/H. This standard is completely implemented in the R&S®AEM100 ATSC-M/H Emission Multiplexer.
True or false: 30 dBm + 30 dBm = 60 dBm? Why does 1% work out to be -40 dB one time but then 0.1 dB or 0.05 dB the next time? These questions sometimes leave even experienced engineers scratching their heads. Decibels are found everywhere, including power levels, voltages, reflection coefficients, noise figures, field strengths and more. What is a decibel and how should we use it in our calculations? This Application Note is intended as a refresher on the subject of decibels.
This paper describes the regulations introduced in Europe that are driving electrical and electronic original equipment manufacturers to move towards non-bromine containing base materials and prepregs (pre-impregnated) to produce printed circuit boards, although the regulations do not acutally ban the FR-4 materials, only bromine content.
The reasons for selecting circuit board are threefold. First, to allow the integration of digital and Radio Frequency (RF) circuitry into a single assembly. Second, to decrease overall printed circuit board (PCB) size. Third to provide additional thermal paths and increase the rigidity of the final assembly.
