Items Tagged with 'multilayer'

Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced that its wholly owned subsidiary, Nano Dimension Technologies, has supplied the first DragonFly 2020 system designated for 3D circuitry and PCBs. The supply was made to a leading defense company in Israel for evaluation purposes and is expected to be installed at the partner’s site in the coming days.

Knowles Capacitors will be at European Microwave Week 2016 in force with a selection of new products across its brands – DLI, Novacap and Syfer. 

 Pulse Electronics Corp., a leading provider of electronic components, has extended its inductor product offerings with a new line of high frequency multilayer ceramic chip inductors. These RF ceramic inductors have low DC resistance, high Q values at higher frequencies, high self-resonant frequency, and high reliability. These new inductors can be used in wireless devices, broadband circuits, RFID devices, RF transceivers, modules, and medical devices. 

With a combined history exceeding 175 years, Dielectric Laboratories (DLI), Novacap, Syfer Technology and Voltronics have come together into a single organisation, Knowles Capacitors. This new entity is a division of Knowles Corp. of USA, an independent publicly traded company. A result of the merging of some of the world’s leading speciality capacitor manufacturers, Knowles Capacitors becomes one team of great people sharing a common vision.

Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announces the capability to develop micron-scale flexible circuits for medical sensor applications, including various in-body and fluid sensors.

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. 

AVX Corp. announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, WA.  Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.