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CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF and Optical FEM.
Supporting the theme “100 Years of FETs: Shaping the Future of Device Innovations,” the 2025 IEDM technical program will consist of 295 presentations, plus a host of events that include Focus Sessions, Tutorials, Short Courses, an evening panel, a career luncheon, supplier exhibit and IEEE/EDS award presentations.
The 71st annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers in all areas of microelectronics research and development, under the theme “100 Years of FETs: Shaping the Future of Device Innovations.”
The 2023 IEDM technical program, supporting the theme, “Devices for a Smart World Built Upon 60 Years of CMOS,” will consist of more than 225 presentations plus a full slate of panels, focus sessions, tutorials, short courses, a career luncheon, supplier exhibit and IEEE/EDS award presentations.
IEDM has issued a call for papers deadline of submission deadline is Thursday, July 13, 2023, seeking original work in all areas of microelectronics research and development.
The 68th annual IEEE International Electron Devices Meeting (IEDM), the leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.
Intel and IBM will present dueling approaches to the development of FinFET technology for the 14 nm technology node in two late-news papers to be given at this year's IEEE International Electron Devices Meeting(IEDM), December 15-17, 2014 in San Francisco, Calif.
