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Yole Group announces the release of the Automotive Semiconductor Trends 2025 report, offering unmatched insights into the competitive dynamics of the fastest-growing segment of the semiconductor industry.
Sivers Semiconductors announced that it has signed a contract to develop high performance, low-cost digitizers based on the NXP Layerscape platform for satcom by Intelsat.
NXP Semiconductors announced that its continued strategic collaboration with geo to leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.
NXP® Semiconductors announced that its single-chip NFC and embedded secure element solution, the SN220, has been certified by the Car Connectivity Consortium® (CCC) under its CCC Digital Key™️ Certification Program.
Richardson RFPD, Inc. announced the availability and full design support capabilities for a curated selection of product recommendations that support 3.3 to 3.98 GHz, 5G Thin mMIMO RF front-end development.
Yole Group provides a comprehensive review of UWB technologies, highlighting and comparing the solutions implemented in smartphones by leading companies, Apple, Samsung and Google (Qorvo).
Richardson RFPD, Inc. announced the availability and full design support capabilities for a new reference design from NXP Semiconductors, the A3G26D055N-100.