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A breakthrough in advanced packaging materials has arrived with YINCAE's introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal and reliability performance for next-generation power electronics and high performance semiconductor applications.
YINCAE Advanced Materials
will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, Calif., USA.
YINCAE announced the launch of its next-generation liquid metal thermal interface material (TIM), engineered with enhanced viscosity properties to deliver exceptional performance, processability and long-term reliability.
