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Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17, iPhone 17 Pro and iPhone 17 Pro Max relies on fully depleted silicon-on-insulator (FD-SOI) substrate technology.
Soitec announced the continuation of its research collaboration with the Microsystems Technology Laboratories (MTL) of the Massachusetts Institute of Technology (MIT), further solidifying its presence in the North American semiconductor sector.
Soitec and SAWNICS announced the availability of a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate high performance RF filter design for 5G smartphones.
CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI technology.
Soitec acquired NOVASiC, allowing Soitec to drive the development of semiconductors for power supply systems in electromobility and industrial applications.
