Traditional fabrication approaches of Microwave/mmWave devices have material, geometry, tolerance, and/or repeatability challenges. New 3D printable resins with desirable Microwave/mmWave characteristics are enabling 3D DLP manufacturing of low-loss and low-dielectric constant material for prototyping and production. This whitepaper discusses applications of this 3D dielectric structure fabrication process.
For reliable and efficient system YOUR TASK verification and debug of DDR3/DDR4 memory designs, comprehensive compliance test and analysis tools are required. While measurement capability and usability are critical to speed up the verification and debug process, it is equally important to choose the right probing solution and use advanced techniques to improve overall measurement accuracy.
As the demand for higher frequencies and wider bandwidths continue their relentless march upward, RF connectors need to keep up with, or even exceed, demands. Mating the RF connector to a PCB or substrate requires careful consideration of several factors to get the full performance out of the connector. This white paper will provide an understanding of what makes successful launches work, what knobs to turn, and design guidelines to make connector launches perform well as the industry moves toward 100 GHz bandwidths.
Antenna tuners in smartphones, like other electronic components, must be able to withstand electrostatic discharge (ESD) at every stage from device manufacturing and smartphone assembly to consumer use. Rather than rely on legacy assumptions, tuner selection should reflect the manufacturing systems and standards of today. Learn more to protect your devices.
5G is now and what’s next? As a new generation of cellular technology typically appears every 8-10 years, 6G can be expected around 2030. Download this white paper to explore the evolution from 5G to 6G from a service, air interface and network perspective.
This article will introduce the three trends driving the need for persistent spectrum monitoring before comparing the benefits of a proactive approach to traditional RF drive tests which are often reactive and capture only a brief snapshot of the wireless environment. It will conclude by highlighting some of the key features and performance requirements RF Engineers should consider when comparing RF receivers.
Remcom’s XFdtd® Electromagnetic Simulation Software contains analysis tools for rapidly characterizing the performance of arrays of antennas for beamforming and beam steering applications. This whitepaper demonstrates how unique features like superposition and array optimization simplify the process for understanding device performance by providing efficient ways to validate array coverage.
RF/mixed signal PCB systems and heterogeneous SiP technologies are increasingly susceptible to delayed product development turnaround times due to higher frequencies and component densities. This paper overviews the Cadence design platforms that provide seamlessly integrated EM and multiphysics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board.
In this publication, Rohde & Schwarz experts review the challenges that mode-agile (WARM) radar and EW threat emitters pose to traditional static threat library implementations in radar and EW systems, and consider the architecture of cognitive artificial intelligence and machine learning systems that can be used to deliver effective RF countermeasures.