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At the innagural
EDI CON taking place March 12 through 14 at the Beijing International convention Center,
Bertram R. Arbesser-Rastburg, who served as the Chairman of the
European Microwave Week in Amsterdam this past October, will share his insights on the future of microwave technology for satellite communication and navigation systems in his presentation, “Microwaves in Space - a European Perspective”.
EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the Call for Papers is open. 
EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces its Measurement Track for this year’s conference and exhibition. The exhibition will host more than 138 exhibiting companies from the RF, microwave, and high-speed digital industries, including demonstration pods in the Signal Integrity Zone.
EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce that GLOBALFOUNDRIES’ Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing, will kick off the newly added RF Silicon on Insulator (SOI) Technology Track with a keynote talk entitled, “RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow.” 
EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.