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KSAT and ThinKom Solutions have partnered to bring ThinKom’s gateway array to market, targeting earth observation, broadband, telemetry, tracking and command and other ground station as a service applications.

RFMW announced that it has completed a significant brand refresh.

Lockheed Martin is partnering with the U.S. Navy to integrate hypersonic strike capability onto surface ships.

Arctic Semiconductor announced it has rebranded from SiTune Corporation to Arctic Semiconductor, to emphasize its focus on 5G RF products and has started shipping its first 5G Si chipset, IceWings, in mass production.

Nokia, NTT DOCOMO, INC. and NTT announced that they have achieved two key technological milestones on the path to 6G. The first is the implementation of AI and ML into the radio air interface and the utilization of new sub-THz spectrum to dramatically boost network capacity.

Verana Networks announced it will conduct field trials of its ground-breaking 5G mmWave integrated access and backhaul (IAB) solution with Verizon.

CHASM Advanced Materials Inc. announced the commercial launch of AgeNT® solutions for transparent antennas in a wide range of connectivity applications.

MACOM has signed a definitive agreement to acquire assets and operations of OMMIC SAS. 

NI confirmed that it has received a proposal from Emerson to acquire the company for $53 per share in cash, following a prior proposal from Emerson to acquire the company for $48 per share.