EMC/EMI

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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EDI CON China 2016 achieves record attendance

EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.


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