Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets
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Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.
The CAP-PPI-0201BB-001 is a substrate scalable Global Model™ for the Passive Plus P/N 0201BB surface mount chip capacitor family. The models are for use with microstrip applications and account for substrate (or printed circuit board) related parasitic effects up to 65 GHz. Models account for up to two higher-order resonant frequency pairs beyond the fundamental series resonant frequency.
Metrigraphics continues to advance their process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12" x 12" or 144 square inches.
Richardson RFPD Inc. announced the availability and full design support capabilities for selected parts from the DG series of wire wound ferrite inductors from TOKO. The DG8040C and DG6045C are part of a new line of wire wound ferrite inductors that cover an inductance range of 1 to 100 µH and feature higher current than previous models. Both device families are RoHS-compliant and magnetically shielded.
Rogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.
Laser Services stocks and delivers custom laser cut microwave absorber material. One of our preferred brands is ECCOSORB® high loss microwave absorber from Emerson & Cuming. It is designed to attenuate electromagnetic interference by converting RF energy to heat.
RFMW, Ltd. announces the availability of RF absorber material tuned to customer specific applications. These free samples are electrically tuned (optimized) to absorb unwanted RF emissions between 1 and 40 GHz based on design requirements provided by the user. These magnetic “Tuned Frequency” absorbers are intended for specular reflection loss.
RFMW Ltd. announces design and sales support for a new line of dual use RF absorber + thermally conductive pad material from MAST Technologies. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders used on RF components.