We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
--> Arrivederci Roma – European Microwave Week 2009 Wrap-up European Microwave Week 2009 Photo Gallery The Latest EuMW News (See all EuMW News) EuMW Welcome Reception – a Taste of Rome Accel-RF Announces New High Power RF Automated Accelerated Reliability Test System Agilent Introduces High Performance Signal Analyser CST...
European Microwave Week 2009 has said Arrivederci Roma after the event was staged in the Eternal City for the very first time. From 28 September to 2 October all roads led to Nuova Fiera di Roma, which was home to the Week’s four conferences — the 39th European Microwave...
In order to foster the competitiveness of the European semiconductor industry, 35 European partners have formed the – Implementing manufacturing science solutions to increase equipment productivity and fab performance (IMPROVE) – joint research project. The project runs from 2009 to the end of 2011 and targets the increased productivity...
AWR and WIN Semiconductors Corp. (WIN) announced the release of the WIN/AWR H2W PH50-00 process design kit (PDK). The PDK for the WIN PH50-00 GaAs enhancement/depletion-mode pseudomorphic high electron mobility transistor (PHEMT) and heterojunction bipolar transistor (HBT) foundry process is the latest in AWR’s series of PDKs available to...
RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high-performance semiconductor components, announced that it has successfully demonstrated industry-leading reliability performance with its high-power Gallium Nitride (GaN) process technology. RFMD's GaN technology demonstrated MTTF = 30 million hours at a channel temperature of 200 degrees...
Tower Semiconductor Ltd. and its US subsidiary, Jazz Semiconductor , announced the availability of its proprietary Deep-Silicon-Via™ (DSV) technology available in its 0.18-micron SiGe BiCMOS (SBC18). The new offering provides a simpler, more innovative way to create a low-inductance ground required to reduce power consumption of power amplifiers (PA)....
Adoption of 802.11n MIMO with multiple transmit streams will help boost the market for Wi-Fi power amplifier modules to twice its 2008 size despite continued pricing pressure. “As prices for single-stream 802.11n (1 x 1) chips dropped to match 802.11g, OEMs have quickly begun to switch from 802.11g to...