Semiconductors / Integrated Circuits

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WIN Semiconductors announced that is has opened FAB B in Taiwan. Co-located in the Hwaya Technology Park with FAB A, FAB B will offer cost-effective synergy in operations. FAB B capacity of 5K Wafer Per Month (WPM) in addition to the existing FAB A operating capacity of 7K WPM...

Auriga Measurement Systems LLC and WIN Semiconductors announced their modeling collaboration for the release of WIN’s new Ku- and Ka-band GaAs PHEMT process. Auriga’s nonlinear Large Signal Model (LS6) will be offered and distributed by WIN to its PP-25 customers. The models were validated against load-pull measurements and accurately...

In January 2007 – around two-and-a-half years’ back – Engalco released the first industry and markets report concerning AESAs. That first report clearly showed that these types of radars already had great operational significance whilst at the same time providing substantial and growing markets for the associated transmit-receive modules...

In an effort to reduce the company’s carbon footprint, use less energy and water, and significantly increase efficiencies, Jazz Semiconductor Inc. , a Tower Group Company, and leading Orange County chipmaker, is conducting an ongoing efficiency overhaul. To be more energy efficient in the operation of its globally competitive...

As one of the first major global events of the year the 2009 GSMA Mobile World Congress was not only eagerly awaited for the technology and evolutionary clues that it would divulge, but also as a barometer of the impact of the global downturn on an industry that has...

Tower Semiconductor Ltd. and Applied Materials Inc. announced that they have signed a five-year contract to support all Applied Materials wafer processing systems at Tower’s Fab 2 manufacturing facility in Migdal Haemek, Israel. Through its Applied Performance Service program, the most cost-effective and flexible service offering in the semiconductor...

WiSpry Inc. , a leader in programmable RF semiconductor products for the wireless industry, announced its first closing for a Series C financing of $10 M dollars. The round was led by a new investor in the company, Paladin Capital Group, which is also gaining a seat on WiSpry’s...

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance semiconductor components, announced it has extended its portfolio of integrated configurable components to include products for the cellular repeater and Wireless Local Area Network (WLAN) markets. The new integrated configurable components include the RF2057...

The program for this year’s International Microwave Symposium (IMS), the annual conference and exhibition of the IEEE Microwave Theory and Techniques Society (MTT-S), is now available. The IMS 2009 conference will feature 430 technical presentations, organized in four technical tracks: Microwave Modeling; Active Components; Passive Components; and Microwave Systems....

Later this year, the first specification for Bluetooth Low Energy (BLE) will be published and products will follow shortly afterwards. The technology is set for stellar adoption. According to a new ABI Research study examining the potential for Bluetooth Low Energy, in 2010 alone nearly 30 million BLE chipsets...