Materials/Packages

Two New High Performance Resonator Materials

In the telecoms and other RF component markets, today's climate means that there can no longer be a trade-off between cost and performance - the designer needs to achieve both. Temex has recognized this fact and addressed it through the evolution of two new generations of materials on which...
Read More

High Speed Digital Packaging

This article presents the detailed design drivers for high speed digital packaging. Transmission line and interconnect requirements for packaging high speed digital assemblies are discussed. Details of the mechanical requirements to properly attach the...
A number of factors are driving the design of high speed digital packaging. At the assembly level, metal boxes are the dominant configuration due to mounting and interconnect constraints. The next assembly connectivity is accomplished through cables, requiring coaxial connectors. Since a variety of companies manufacture many of the...
Read More

2003 Connector, Cable and Cable Assembly Survey

This is the first survey of connectors, cables and cable assemblies sponsored by Microwave Journal. We hope to update it annually with increased industry participation.
On December 13, 2002, we sent a questionnaire to 75 companies that provide products and services in this field, with a response deadline of January 11th. We used e-mail rather than the USPS so that we would have feedback that all the questionnaires were received. On January 3, 2003,...
Read More

MIM Technology for RF Connector Production

When developing and producing complex RF connector housings, costs can be high and the process complex due to the sheer number of required machined metal components and the diversity of the necessary assembly. However, these difficulties can be overcome by employing molded injected metal (MIM) technology for connector manufacturing....
Read More

Gold Stud Bumps in Flip-chip Applications

As power requirements and operating frequencies increase, more and more designs will look toward ball bumps as an interconnect solution. While solder has traditionally been the incumbent material for these bumps, its limitations have become manufacturi...
As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...
Read More
See More Videos