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Integrated Interconnect Technologies for 3D Nanoelectronic Systems Muhannad S. Bakir and James D. Meindl, Eds. Make way for solutions to the challenges in chip reliability, power delivery, I/O signaling and heat removal now blocking the way to ultimate performance 3D gigascale SoC. This cutting-edge book on off-chip technologies puts...

W.L. Gore & Associates Inc. , maker of GORE-TEX® fabric and thousands of other innovative products, has announced it has earned a position on FORTUNE magazine’s annual list of the “100 Best Companies to Work For” for the 12 th consecutive year. Gore is ranked No. 15. “Gore is...

Labtech Microwave , a wholly-owned subsidiary of Intelek plc , and one of the UK’s leading designers and manufacturers of microwave solutions and bespoke microwave component technology, has secured the first tranche of new orders from two European-based customers with a combined initial value of £790,000. The first major...

IEEE , the world's largest technical professional society, is commemorating its 125 th Anniversary this year with a variety of activities surrounding the theme of "Celebrating 125 Years of Engineering the Future." Major anniversary events include the first IEEE Presidents' Change the World Competition for college and university students...

Rogers Corp. 's Advanced Circuit Materials Division (ACMD) and its newly formed Thermal Management Solutions (TMS) Division will be exhibiting RO4000®, RO2808® and ULTRALAM® 3000 advanced high frequency laminates along with HEATWAVE™ and COOLSPAN™ thermal management products at the upcoming DesignCon 2009 show to be held at the Santa...

Rogers Corp. has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam, which will help fabricators produce highly accurate gaskets. This new product is the solution that...

Leader Tech announced the completion of its Phase II, Global EMI Shielding Technology Center expansion. Since the grand opening announcement in May of 2008, Leader Tech has benefited from a notable increase in demand for the company’s board-level EMI Shielding products. The most recent expansion includes the addition of...

Hesse & Knipps , a manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, will partner with MEW Consulting , recently founded by Michael Whitehead, to provide technical support for third-party wedge and wire bonding equipment being phased out by the original manufacturers. Through the partnership,...

The Advanced Circuit Materials (ACM) Division of Rogers Corp. will be exhibiting its RT/duroid® high frequency materials and its RO3000® and RO4000® laminates at the upcoming IEEE Radio & Wireless Symposium in San Diego, CA during Radio & Wireless Week, January 19-20, 2009. Featured RT/duroid materials on hand at...