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NYU Tandon School of Engineering has named Sundeep Rangan as the new director of NYU WIRELESS, one of the school’s flagship research centers focused on next-generation wireless communications, quantum technology, robotics and health systems.
AGC Multi Material America, Inc. (AMMA) announced an expansion of its partnership with Tritek Circuit Products, Inc., broadening Tritek’s distribution territory for AMMA’s digital laminate and prepreg materials.
Keysight Technologies, Inc. has announced the release of WirelessPro 3GPP AI Simulation Platform, a next-generation software platform designed to meet the evolving needs of wireless communication system engineers.
AccelerComm and Radisys® Corporation announced that a joint project to support the development of the next generation of non-terrestrial networks (NTNs) has been funded through the UK Space Agency’s International Bilateral Fund (IBF).
MBDA has signed a contract with the National Directorate of Naval Armaments for the production of the TESEO MK2/E anti-ship missile, which is currently under development for the Italian Navy.
Molex has released the results of a survey exploring top trends, technology innovations and evolving career skills impacting design engineers at aerospace and defense companies.
AAR CORP. announced it has acquired American Distributors Holding Co., LLC (ADI) for $146 million in an all cash transaction funded using the company’s existing revolving credit facility.
Indra Group is taking part in the European 5G-HUB project with its innovative SATCOM solution, a satellite communications system developed to guarantee robust, secure and resilient connectivity in emergency situations and remote environments without any terrestrial coverage.
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