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The Global mobile Suppliers Association (GSA) announced the initial founding partners and members of the new GSA 4G-5G Fixed Wireless Access (FWA) Forum.
Glass substrate revenue is expected to exceed US$580 million by 2025, mainly supported by fan-out wafer-level packages (FO WLP), wafer level optics, actuators, MEMS and sensors, according to Yole Développement.
With the automotive, semiconductor and mobile communication sectors increasingly developing applications that require the E-Band spectrum range, HUBER+SUHNER has announced its MXPM90 test solution for frequencies up to 90 GHz.
Nordic Semiconductor announced that it is expanding its in-house wireless technology expertise into Wi-Fi after acquiring the entire Imagination Technologies Ensigma Wi-Fi development team and associated Ensigma Wi-Fi IP tech assets.
The global WLP market was worth US$3.3 Billion in 2019 and is expected to grow at an 8.9 percent CAGR to reach US$5.5 Billion by 2025. WLCSP/Fan-In was worth more than $2 Billion in 2019 and is expected to grow at a CAGR of 3.2 percent to exceed $2.5 Billion by 2025, according to Yole Développement.
CML Microcircuits introduces the CMX940, a fully integrated Fractional-N RF synthesiser with voltage-controlled oscillator (VCO) that achieves low phase noise and excellent spurious performance in a low-power single-chip solution.
Filtronic plc, a designer and manufacturer of RF, microwave, and mmWave products for the wireless telecoms, mission-critical communications and defence applications markets, announced that it has joined the HAPS Alliance, a non-profit association dedicated to building a High Altitude Platform Stations (HAPS) ecosystem that brings digital connectivity to everyone, everywhere.
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