We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Rohde & Schwarz has extended its portfolio for generation and analysis of 5G signal waveforms. For 5G base stations, RF test solutions for the 5G frequency ranges FR1 (450 MHz to 7.125 GHz) and FR2 up to 44 GHz will be demonstrated.
u-blox has completed AT&T’s chipset verification process for the UBX-R5 multi-band low power wide area chipset platform to operate on the carrier’s LTE-M network for the Internet of Things. The chipset features end-to-end device security, data security and access control management.
China Unicom Beijing and Huawei have jointly completed the world's first commercial adoption of the 5G LampSite 300 MHz digital indoor system at the Beijing Long Distance Call Building. The system supports network sharing between China Unicom Beijing and China Telecom Beijing and provides a downlink perceived rate of up to 3.4 Gbps over a single headend in multi-user scenarios.
Qualcomm Technologies sees 5G as the mobile innovation platform for this decade and beyond. That compels them to lead the 5G evolution, building upon the solid foundational technologies that were established in 3GPP Rel-15.
Microwave Journal editors Pat Hindle and Gary Lerude cover the March Cable and Connector supplement articles/products, 5G news and Satellite 2020 event in DC.
A room-temperature bonding technique for integrating wide bandgap materials such as GaN with thermally conducting materials such as diamond is intended to improve GaN device cooling to achieve higher output power, improved reliability and reduced manufacturing costs.
Rohde & Schwarz and CommSolid have partnered up to demonstrate the effectiveness of the NB-IoT Release 15 feature wake up signal in reducing the power consumption of NB-IoT devices.Test functions newly implemented on an R&S CMW290 Functional Radio Communication Tester are employed to outline the difference in power consumption for NB-IoT devices with and without the wake up signal technology.
ACM Research, Inc. introduced the Ultra SFP ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.
RSS
