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Nokia leads the way in the next generation of wireless networks as the overall project leader for Hexa-X, the European Commission’s 6G flagship initiative for research that will drive the overall 6G vision.
Technology company LPKF has opened and started production in their newly built clean room fab for manufacturing glass components at the company's headquarters in Garbsen.
The Global Mobile Suppliers Association (GSA) announced the the number of 5G devices has surpassed 500 for the first time, accompanied by rapid increase in the number of commercially available 5G devices.
TIM, Ericsson and Qualcomm Technologies, Inc. are leaders once again with a new record for ultrabroadband long distance speed with 5G technology applied to Fixed Wireless Access (FWA).
Microwave Journal editors Pat Hindle and Gary Lerude discuss the Dec issue cover development focused on Gov't/Military Electronics theme and EuMW Show issue plus cover technical features, EuMW 2020 and industry news.
ZTE Corporation, along with China Unicom and Beijing Jiaotong University, has introduced the industry's first trusted spectrum sharing solution based on the blockchain technology in the RAN sharing scenario.
ThinKom Solutions, Inc. announced it is supplying its ThinAir® Ka2517 aero satellite antennas to GDC Technics, in support of Inmarsat’s next-generation GX terminal and associated inflight broadband services.
Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1.
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