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Raltron Electronics announced the release of the OX6580MK D3 20 100.000 12, a 100 MHz OCXO optimized for applications that demand exceptional close in phase noise and long term frequency stability.
Taoglas announced the FXP30x and PC30x series of high performance embedded combination antennas, a new family of compact antennas designed to support cellular, GNSS and Wi-Fi® connectivity for space-constrained electronic devices.
FormFactor, Inc. and Rohde & Schwarz announced a strategic co-marketing partnership as part of FormFactor’s MeasureOne partner program, a solution-integration initiative designed to deliver validated, turnkey on-wafer test systems.
NXGSAT, in partnership with ETL Systems, has successfully demonstrated an interoperable, fully productised 5G NTN solution, combining NXGSAT’s software-defined 5G NTN UE modem with ETL’s GENUS Digital platform, integrated through the DIFI standard.
Kymeta Corporation announced its new Kestrel™ u5, a small and capable multi-orbit satcom terminal designed for the unmanned systems and national security sectors as well as high speed industrial mobility operations.
ThinKom Solutions, Inc. announced the launch of its new Containerized Digital Array, a transportable ground station that replaces vulnerable dish-based ground entry points.
Emerson announced details of its annual NI Connect conference, being held May 12-14 at the Fort Worth Convention Center under the theme “Productivity Reimagined.”
Groundbreaking research is underway at Northrop Grumman’s Microelectronics Center (NGMC) which is reshaping physicists’ understanding of diamonds, positioning them as the next-generation material used in manufacturing microelectronics.
IBL Lab GmbH, the DAkkS-accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities with a substantial investment in a suite of high-power amplifier systems from Rohde & Schwarz.
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