RF & Microwave Industry News

Agilent's SystemVue Offers Modeling, Scripting Capability

Agilent Technologies Inc. announced the release of its SystemVue 2010.07 software. This system-level design environment now provides the ability to perform complete mathematical modeling and scripting in SystemVue using MATLAB software. SystemVue also supports a new W1905 RADAR model library, which provides intellectual property (IP) reference blocks for scenario...
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picoChip Partners with FemTel on TD-SCDMA Femtocell

China’s FemTel Communications is using picoChip technology to deliver the F100-T femtocell, which is based on picoChip’s PC8808 TD-SCDMA reference design and PC202 silicon. It is already being used in field trials by a leading operator in China. The PC8808 TD-SCDMA femtocell software reference design was developed in China...
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e2v Launches Mini Helix TWT

e2v , a provider of technology solutions for high performance systems, has launched the N20180 mini helix Travelling Wave Tube (TWT). This latest addition to the company’s range of TWTs now allows system designers to use a single RF amplifier over the multi-octave bandwidth, offering the advantages of reduced...
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Ceragon Acquires Next Generation RFIC Design House

Ceragon Networks Ltd. , a provider of high-capacity, 4G/LTE-Ready wireless backhaul networks, announced that it has acquired all the shares of privately-held Elxys Innovations , Athens, Greece. Elxys is a designer of advanced, next-generation radio-frequency integrated circuits (RFIC). The acquisition solidifies Ceragon's leadership in RF design and allows it...
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Global Satellite Community to Gather at SATELLITE 2011

SATELLITE 2011, the premier annual event dedicated to providing solutions to the satellite end-user community, is returning to the Walter E. Washington Convention Center in Washington, D.C., to celebrate its 30th Anniversary. The SATELLITE Conference and Exhibition will be held March 14-17, 2011. The SATELLITE Conference and Exhibition will...
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Arlon Showcases New MultiClad HF Product

ARLON ’s new MultiClad™ HF is the next generation of halogen-free, low-loss thermoset and prepreg system for high-speed and high-frequency multilayer printed circuit boards. MultiClad HF is a thermally robust, high durability system with a high Tg (205° by DSC), low Z-direction expansion (1.2 percent from 50° to 260°C)...
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