Industry News

BAE System’s Scottish Site Achieves Highest Standard

The quality management system at BAE Systems , Hillend, Dunfermline, UK, has been accredited with Aerospace Standard AS9100 – the highest standard required by the aerospace and defense industry. The operations at Hillend currently provide electronic assemblies and circuits for leading defense programs. The approval follows a successful eight-day...
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Video Demonstrates New EM Design Possibilities

Vector Fields has published a video exploring the potential of a radical new type of tool for optimizing electromagnetic equipment designs. The video illustrates a process that makes auto optimization possible, and within practical timescales for almost any scale of problem, even if a user specifies several or even...
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Aeroflex and Innowireless Partner

Aeroflex and Innowireless announced that they have entered into a technology partnership designed to accelerate the development of 3GPP LTE mobile devices for subscribers. The partnership will enable the two companies to combine their extensive engineering skills and resources to collaborate on the development of a new 3G LTE...
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IDT Uses Cadence Encounter Conformal Constraint Designer

Cadence Design Systems Inc. , a leader in global electronic-design innovation, announced that Integrated Device Technology Inc. (IDT), a leading provider of mixed signal semiconductor solutions that enable the digital media experience, was able to quickly deliver an IDT PanelPort™ device, an innovative DisplayPort-compatible digital display receiver and timing...
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WCA 2008 Event to Contrast WiMAX, LTE 4G Visions

A timely and unique debate on the growing battle between two dominant global visions of Fourth Generation wireless technology – WiMAX and Long Term Evolution (LTE) – will be held next week at WCA 2008, the annual convention of the Wireless Communications Association International (WCA). Following the record-breaking $19...
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JMD Modules Pass JEDEC Reliability Qualification Testing

Jacket Micro Devices Inc. (JMD) announced that laminate-based radio frequency system-in-package (RF SiP) products made with its patented Multi-Layer Organic (MLO) process have passed JEDEC reliability qualification testing. The MLO substrates, and modules assembled using them, are lead (Pb) free and RoHS-compliant. WLAN front-end modules using HDI 6-layer MLO...
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