RF & Microwave Industry News

Xilinx and Analog Devices achieve JEDEC JESD204B interoperability

Xilinx Inc. and Analog Devices Inc. announced that they have achieved JESD204B interoperability between Xilinx JESD204 LogiCORE™ IP in the Kintex®-7 FPGA and the ADI AD9250 analog-to-digital high-speed data converter. Achieving JESD204B interoperability between logic and data converter devices is a significant milestone in promoting the widespread adoption of this new technology.


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Communications tests go the distance for MAVEN

It's not easy to simulate millions of miles electronically, but that's what engineers did recently as they tested the all-important communications system the MAVEN spacecraft will use to relay its study results from Mars orbit to Earth-bound researchers.


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Mini-Circuits to sponsor IEEE COMCAS 2013

Mini-Circuits is pleased to contribute to the 2013 IEEE Conference on Microwaves, Communications, Antennas, and Electronic Systems(COMCAS) as a platinum sponsor. Representatives from Mini-Circuits and MCDI, Mini-Circuits’ new distributor in Israel, will be exhibiting at Booth 31 with a showcase of its rapidly growing line of portable test equipment and other selected new products.


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A1 Microwave to showcase world's smallest waveguide X-Band Tx and Rx filters at EuMW

A1 Microwave has released the world’s smallest waveguide X-Band Tx and Rx filters for military satcom applications. The filters have less than 0.3 dB insertion loss and have greater than 90 dB rejection in the complementary frequency bands. They are considerably shorter and lighter weight than equivalent filters on the market, which makes them ideal for portable solutions. These are stock items for immediate delivery.


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RFMD expands assembly capacity to accommodate strong product demand

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has successfully completed a recently announced expansion of its test, tape and reel, and assembly facility, located in Beijing, China. In addition to newly qualified internal assembly capacity for power amplifiers (PA), switch-based products, and antenna control solutions, RFMD is also qualifying advanced flip chip capabilities for its 2G, 3G, and 4G LTE and TD-LTE products.


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