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Indium Corporation® will highlight its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS), June 7-12, in Boston, Mass.
Indium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products
Indium Corporation announced its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience based on their individual career goals and interests.
Indium Corporation announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium (IMS), San Diego, Calif., June 11–16.