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Indium Corporation® has released a new, bismuth-based, low temperature alloy developed for low temperature reflow processes which require enhanced thermal cycling reliability.
As the senior product development specialist, Hotvedt plays a highly visible and critical role in the future of Indium Corporation’s solder paste business.
Indium Corporation announced two new additions to its Engineered Solder Materials (ESM) team—Igor Faleichik, senior product specialist, and Jim McCoy, product specialist.
Indium Corporation® announces that it is now offering CW-818, a uniquely formulated no-clean, high-reliability flux-cored wire designed to minimize cycle times in manual and robotic soldering processes while delivering top tier soldering speed and spread.
Indium Corporation® will feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan, including its GalliTHERM™ portfolio of Ga-based liquid metal solutions.
Indium Corporation will be promoting products developed to solve common issues facing companies that are producing technology for the RF/micro application sector, at IMS2022.
Indium Corporation® will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31 to June 3, San Diego, Calif.
Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 19–24.
