Articles Tagged with ''edicon''

Richardson RFPD Inc. announced its sponsorship of a small cell workshop at the 2015 Electronic Design Innovation Conference (EDI CON 2015).

NI (formerly AWR Corp.) will be showcasing NI AWR Design Environment™ software at Booth #315 at the Electronic Design Innovation Conference 2015 (EDI CON), being held April 14-16 in Beijing, China.

M/A-COM Technology Solutions Inc. ("MACOM"), a leading supplier of high-performance analog RF, microwave, millimeter wave and photonic semiconductor products, will showcase a broad portfolio of new products for multi-market, aerospace, defense and networking applications at Booth # 321 at EDI CON 2015 in Beijing, China.

AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014.  V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.