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Mauna Kea Semiconductors (MKSemi) announced the closing of Series Pre-A+ funding totaling $12.8 million led by Lightspeed China Partners with participation by marquee investors Qiming Venture and Ivy Capital.
Infineon Technologies AG is launching the AIROC™ CYW20829 Bluetooth® LE SoC, a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.
Infineon Technologies AG announced the launch of the new AIROC™ Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high performing Matter products to market.
The new SoC series provides advanced RF signal processing with expanded digital functionality and RF capacity that greatly improves 5G RU performance and energy efficiency.
BMW Group selects Vision Perception, Vision System-on-Chip and ADAS Central Compute System-on-Chip from Qualcomm Technologies’ Snapdragon Ride ADAS Platform for its next generation of ADAS and autonomous driving systems.
MaxLinear Inc. announced the immediate availability of a power management integrated circuit, the XR77103-MoCA, designed to meet the power needs of MaxLinear MxL370x MoCA 2.0 and MxL371x MoCA 2.5 SoCs.
Wireless Telecom Group announced that Shared Spectrum Company has selected 5G New Radio hardware and software from CommAgility for a U.S. Department of Defense project.
Morse Micro announced the availability of Wi-Fi HaLow SoC and module samples to early access partners and key customers to evaluate the market-leading throughput, power efficiency and extended range of the company’s Wi-Fi HaLow solutions.