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Keysight Technologies, Inc. announced it has extended its collaboration with Synopsys with the integration of PathWave RFIC Design (GoldenGate) with Synopsys Custom Compiler™ design environment and Synopsys PrimeSim™ circuit simulation solutions.
OnMicro has entered a distribution agreement with Takachiho Koheki (TK) Co. Ltd to represent OnMicro and promote its RF front-end and SoC products throughout the Japan market.
Picocom announced that through close partnership with Radisys, they are delivering joint 5G Open RAN platforms to customers based on Picocom’s PC802 small cell SoC and Radisys’ Connect RAN 5G software.
Mauna Kea Semiconductors (MKSemi) announced the closing of Series Pre-A+ funding totaling $12.8 million led by Lightspeed China Partners with participation by marquee investors Qiming Venture and Ivy Capital.
Infineon Technologies AG is launching the AIROC™ CYW20829 Bluetooth® LE SoC, a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.
Infineon Technologies AG announced the launch of the new AIROC™ Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high performing Matter products to market.
The new SoC series provides advanced RF signal processing with expanded digital functionality and RF capacity that greatly improves 5G RU performance and energy efficiency.
BMW Group selects Vision Perception, Vision System-on-Chip and ADAS Central Compute System-on-Chip from Qualcomm Technologies’ Snapdragon Ride ADAS Platform for its next generation of ADAS and autonomous driving systems.
MaxLinear Inc. announced the immediate availability of a power management integrated circuit, the XR77103-MoCA, designed to meet the power needs of MaxLinear MxL370x MoCA 2.0 and MxL371x MoCA 2.5 SoCs.
