Articles Tagged with ''process''

AEM's tin whisker mitigation process assures surface-mount component reliability

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.


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TriQuint accelerates GaN offerings, releases significant new products and foundry services

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced 15 new gallium nitride (GaN) amplifiers and transistors along with two new GaN processes. These products offer performance, size and durability advantages for communications, radar and defense RF systems. TriQuint innovation will be displayed at the IEEE IMS / MTT-S convention and exhibition in Seattle, Washington, June 4-6, Booth 530.


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