Articles Tagged with ''substrates''

Intel and IBM will present dueling approaches to the development of FinFET technology for the 14 nm technology node in two late-news papers to be given at this year's IEEE International Electron Devices Meeting (IEDM), December 15-17, 2014 in San Francisco, Calif.

Teledyne Microwave Solutions has invested in the Teledyne Labtech facility at Presteigne, Wales, following the recent completion of the installation of the new Shadow Line processing equipment in support of increased production requirements.

 Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced a major qualification win in partnership with KSG Leiterplatten GmbH and InnoSenT GmbH. 

Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

IQE plc announces the launch of gallium nitride based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates supplied by the WBG Materials subsidiary of II‐VI Inc. (NASDAQ: IIVI), a global provider of engineering materials and optoelectronic components.

Rogers Corp., represented by its Power Electronics Solutions (PES) Division, will showcase some of its most advanced products for power electronic applications at the upcoming APEC 2013 conference and exhibition.

STMicroelectronics, Soitec (Euronext) and Circuits Multi Projets^®(CMP) announced that ST’s CMOS 28 nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.