Articles Tagged with ''chipset''

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.

M/A-COM Technology Solutions Inc. (M/A-COM Tech) introduced at the International Microwave Symposium (IMS/MTT-S) Trade Show, in Montreal, Canada, a 42GHz SMARTSET Chipset for point-to-point radio applications.

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD's FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world's leading WiFi chipset providers.

GigOptix, Inc., a leading fabless supplier of semiconductor and optical components that enable high speed information streaming, announced that it will showcase its portfolio of wideband and E-band solutions at the International Microwave Symposium (IMS2012) in Montreal, Canada on June 17-22, 2012.

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.

Hittite Microwave Corp. announces the release of the highly integrated HMC6000/6001 silicon transceiver chipset which targets 60 GHz applications such as: metrocell/picocell backhaul, WiGig (IEEE 802.11ad) multi-Gbps solutions including wireless cable replacement (HDMI, USB 3.0, DisplayPort), wireless docking stations, video/magazine kiosks and wireless sensors.