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Infineon Technologies AG is strengthening its market leadership in power semiconductors by adding significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors.
Mauna Kea Semiconductors (MKSemi) announced the closing of Series Pre-A+ funding totaling $12.8 million led by Lightspeed China Partners with participation by marquee investors Qiming Venture and Ivy Capital.
Infineon Technologies AG is launching the AIROC™ CYW20829 Bluetooth® LE SoC, a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.
Infineon Technologies AG announced the launch of the new AIROC™ Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high performing Matter products to market.
Infineon Technologies AG's newly developed AIROC™ brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC.
Infineon Technologies AG and Cree Inc. announced that Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division of Cree. The deal also includes the related SiC wafer substrate business for power and RF power. The purchase price for the all-cash transaction is $850 million (approximately €740 million).
By the end of 2016, more than half of all new automotive 77 GHz radar systems will be equipped with chips from Infineon Technologies. Thus, one in 15 new cars will use a driver assistance system utilizing the company’s 77 GHz radar chips.
At bauma 2016, Infineon is presenting its latest 24 GHz radar solution, which was developed for the modern, radar-based assistance systems in trucks and construction machines.