Articles Tagged with ''embedded''

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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Gore and Kontron collaborate on next-gen airborne digital networks

 As the passenger demand for quick and easy access to in-flight entertainment and connectivity (IFEC) increases, aircraft IFEC systems need to provide faster data transmission over longer distances. W. L. Gore & Associates and Kontron – a global manufacturer of embedded computer modules, boards and systems – are working together to successfully meet these growing demands. 


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Teledyne LeCroy adds mixed signal capabilities to HD oscilloscopes

Teledyne LeCroy introduces the HDO4000-MS and HDO6000-MS high definition oscilloscopes which combine 16 channels of flexible mixed signal capabilities with HD4096 high definition technology, long memory, and a compact form factor, in bandwidths from 200 MHz to 1 GHz. All HDO models sport a large 12.1” touch-screen display and intuitive interface to enhance operation. Powerful debug tools, plus a full complement of automatic measurements, and waveform math capabilities turn the HDO-MS oscilloscope into an all-in-one analog, digital, serial debug machine.


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