Articles Tagged with ''wireless''

TI introduces 2.4 GHz SoCs to low-cost RF value line

Texas Instruments Inc. (TI) (NASDAQ: TXN) announced that its low-cost radio frequency (RF) value line of system-on-chips (SoCs) now supports 2.4 GHz frequency bands with the new CC2543, CC2544 and CC2545 SoCs. The SoCs integrate a microcontroller (MCU), 32kB flash and one or two kB RAM on a single die, making them ideal solutions for consumer electronics requiring cost and space efficiency.


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RFaxis 2nd gen pure CMOS single-chip/single-die RFeICs Outperform GaAs/SiGe based RF front-end

RFaxis, a fabless semiconductor company focused on innovative, next-generation RF solutions for the wireless connectivity and cellular mobility markets, announced it will start volume production of its second-generation, pure CMOS-based RFeICs in Q4 2012. The new solutions will serve rapidly growing markets including smartphone and tablets, WLAN 11a/n/ac, ZigBee, wireless audio, smart energy and home automation.


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Anritsu introduces LTE advanced carrier aggregation software

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Anritsu MD8430AAnritsu Co. announces the industry’s first call-based LTE Advanced Carrier Aggregation testing capability that can be integrated into its MD8430A LTE Signaling Tester. The software-only upgrade leverages the four available RFs in the MD8430A, and provides 300 MB/s downlink throughput using two 2x2 MIMO Component Carriers (CCs). 


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New amplifiers from MILMEGA used for wireless testing

MILMEGA, now a part of Teseq, offers a new amplifier product range designed to meet test requirements within wireless testing frequency bands.  The AS0728 family of amplifiers has a frequency range of 700 MHz to 2.8 GHz.  Available in 25 W, 50 W, 100 W and 170 W P1 dB power levels, these new amplifiers are ideal in the wireless communications industry where high reliability, excellent linearity, power density and leading performance are required.


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Wireless connectivity chipsets revenues to exceed $10 B in 2012

The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.


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Javelin Semiconductor supplies PA to Samsung for Galaxy S Duos

Javelin Semiconductor Inc., innovator of the world’s first high-performance CMOS 3G power amplifier (PA), announced that Samsung Electronics Co. Ltd., has selected Javelin’s PA for the new Galaxy S Duos with dual SIM functionality. The Galaxy S Duos is a stylish Android-based smartphone that features a 4-inch touchscreen, 1 GHz processor, 5 megapixel camera, Bluetooth, GPS and Wi-Fi.


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Wireless sensor network market to exceed 80 M units shipped in 2012

The wireless sensor network market, led by ZigBee, grew ten-fold from 2007 to 2010 and exceeded 45 million annual shipments in 2011. “Strong growth is expected for 2012 and beyond as ZigBee pervades the home automation and home entertainment markets, whilst Smart Meters continue to be rolled out across the globe,” commented Peter Cooney, wireless connectivity practice director.


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Advantech Wireless releases new C-Band rackmount 200-500 W GaN SSPA/BUC

Advantech Wireless, a Canadian-based manufacturer of broadcast-quality Satellite, RF Equipment and Microwave Systems announces the release of a new series of indoor, GaN technology based solid state power amplifiers (SSPAs) and BUCs featuring high power, high linearity and a compact size. Named the Super Compact SG Series, the high power amplifiers can easily replace old technology and inefficient TWTAs, offering enormous cost saving and reduce operating costs. The units practically pay for themselves in a short time.


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