Articles Tagged with ''wireless''

As wireless connectivity attach rates increase in many markets and OEMs continue to push for cost savings, IC vendors such as Broadcom, Qualcomm, TI, Marvell, MediaTek and others, have created integrated wireless connectivity solutions to gain market share. These solutions known as Wireless Connectivity Combo ICs have already seen rapid adoption in smartphones and are now seeing strong usage growth in many other end applications including laptops, flat panel TVs, and automotive infotainment systems.

Cree Inc. and Array Wireless help bring the clarity of high-definition (HD) video transmission to Sunday Night Football (SNF) on NBC. The HD NFL games are broadcast using wireless video systems from Array Wireless that employ Cree’s advanced GaN RF components. Array Wireless counts on Cree world-class RF GaN technology to create high efficiency, low distortion, robust power amplifiers that are essential for high-definition video transmission.

Cisco remains on the top spot of the enterprise Wireless Local Area Networks (WLAN) equipment market with 36 percent of the world market share followed by ZTE and Aruba based on shipments. Cisco has a dominating presence in North America and European markets, but is increasingly losing ground from close competition from ZTE in APAC, Latin America, and MEA.

Agilent Technologies Inc. announced it will demonstrate its newest LTE and WLAN test and measurement solutions, which cover the global technology and applications ecosystem for next-generation mobile broadband networks, at 4G World (Booth 322), McCormick Place West,  in Chicago, Oct. 30-31.

The market for mobile handset IC, including platform and connectivity ICs, surpassed $32 billion in 2011 and is forecast to grow a further 11 percent in 2012 to reach $35.7 billion. Growth is being led largely by the smartphone segment, with ultra-low end handsets also growing strongly. “Qualcomm stands out as the market leader with 26 percent overall share in 2011,” stated Peter Cooney practice director, of semiconductors,  “its continuing focus on the handset market and in particular its efforts to increase platform integration look set to further strengthen Qualcomm’s hold on the market in the near term.”

The number of Wi-Fi enabled devices shipped in 2012 is expected to surpass 1.5 billion. Growth is occurring across many markets including mobile handsets, laptops, media tablets, printers, TVs, and automotive. “Since 2009 over 9 billion Wi-Fi enabled devices have been shipped,” commented Peter Cooney, wireless connectivity practice director, “whilst growth was driven by networking in the early years the smartphone soon became the major market.

Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).

Freescale Semiconductor announced new two-stage, low-noise amplifiers (LNAs) that address two gain stages in one device and deliver coverage across multiple bands to simplify wireless base station designs.

Texas Instruments Inc. (TI) is offering developers a comprehensive portfolio of cognitive radio solutions based on its TMS320C66x DSP generation. 

Texas Instruments Inc. (TI) (NASDAQ: TXN) announced that its low-cost radio frequency (RF) value line of system-on-chips (SoCs) now supports 2.4 GHz frequency bands with the new CC2543, CC2544 and CC2545 SoCs. The SoCs integrate a microcontroller (MCU), 32kB flash and one or two kB RAM on a single die, making them ideal solutions for consumer electronics requiring cost and space efficiency.