Samtec, Inc. announces the expansion of its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5 mm stack height.
Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635 mm pitch. These connectors are optimized for high-throughput applications such as high performance computing, artificial intelligence, storage and networking.
Key features include:
- Protocol compatibility with PCIe 6.0, CXL 3.2, and 100 GbE
- 800-position configuration (8 rows × 100 positions) in a dense footprint of 68.62 × 18.20 mm (2.701 × 0.717 in.)
- 5 mm mated stack height, with a 10 mm version planned for Q2 2026
- 5 Ohm impedance
- 2 A max current rating (one pin powered per row), and 150 VAC (212 VDC) max voltage rating
- Open pin field array design for maximum grounding and routing flexibility.
The APM6 and APF6 connectors utilize Samtec’s Solder Column Termination, enhancing structural integrity. This IPC Class 3 compliant method is ideal for dense, high speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.
“These new 800-position connectors represent a significant advancement in high-density, high speed interconnect technology,” said Eric Mings, Samtec’s high speed board-to-board product manager. “They’re designed to meet the rigorous demands of today’s data-intensive systems while maintaining reliability.”
Samtec’s APM6 and APF6 products are available directly through Samtec or through authorized distribution partners.